Publications
Found 2 results
Author Title Type [ Year
Filters: First Letter Of Last Name is A and Author is An, Hyowon [Clear All Filters]
"Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
, "Fabrication and Characterization of Nanoporous Metallic Interconnects Using Electrospun Nanofiber Template and Electrochemical Deposition", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
,