Congratulations to Sunghyun Hwang (Dr. Yoon’s Group) on his recent journal publication in IEEE Transactions on Components, Packaging and Manufacturing Technology! This work, “Metal assisted chemical etching toward scallop-free-sidewall through silicon vias: A Review”, discusses current TSV (Through-Silicon Via) fabrication technologies and recent advancements in the MACE (Metal-Assisted Chemical Etching) based fabrication process. This review addresses the existing challenges associated with the conventional MACE process and offers insights into the prospective developments that may lead to scallop-free Through-Silicon Via fabrication in the future. Congratulations, Sunghyun! Keep up the impressive work!
Check out the publication: Metal assisted chemical etching toward scallop-free-sidewall through silicon vias: A Review | IEEE Journals & Magazine | IEEE Xplore
