Publications

Found 63 results
Author Title Type [ Year(Desc)]
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2017
Desai, V. H., B. S. Spearman, C. S. Shafor, S. Natt, B. Teem, J. B. Graham, E. W. Atkinson, R. A. Wachs, E. A. Nunamaker, K. J. Otto, et al., "Design, fabrication, and characterization of a scalable tissue-engineered-electronic-nerve-interface (TEENI) device", 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER), Shanghai, China, IEEE, 2017.
Tahafchi, P., R. Molina, J. A. Roper, K. Sowalsky, C. J. Hass, A. Gunduz, M. S. Okun, and J. W. Judy, "Freezing-of-Gait detection using temporal, spatial, and physiological features with a support-vector-machine classifier", 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju Island, South Korea, IEEE, 2017.
Graham, J. B., E. W. Atkinson, E. A. Nunamaker, B. S. Spearman, V. H. Desai, C. S. Shafor, S. Natt, R. A. Wachs, C. E. Schmidt, J. W. Judy, et al., "Histological evaluation of chronically implanted tissue-engineered-electronic-neural-interface (TEENI) devices", 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER), Shanghai, China, IEEE, 2017.
Nunamaker, E. A., B. S. Spearman, J. B. Graham, E. W. Atkinson, V. H. Desai, C. S. Shafor, S. Natt, R. A. Wachs, C. E. Schmidt, J. W. Judy, et al., "Implantation methodology development for tissue-engineered-electronic-neural-interface (TEENI) devices", 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER), Shanghai, China, IEEE, 2017.
Spearman, B. S., S. Mobini, R. A. Wachs, V. H. Desai, C. S. Shafor, J. B. Graham, E. W. Atkinson, E. A. Nunamaker, K. J. Otto, J. W. Judy, et al., "Mechanically-tunable Extracellular Matrix Hydrogel Scaffold for Use in a Tissue-Engineered Electronic Nerve Interface (TEENI)", Society for Biomaterials, Minneapolis, MN, 2017.
Kuliasha, C., P. Rustogi, S. Natt, B. S. Spearman, S. Mobini, J. B. Graham, E. W. Atkinson, E. A. Nunamaker, K. J. Otto, C. E. Schmidt, et al., "Microfabrication and Assembly Processes for Integrating Microelectrode Arrays into Tissue-Engineered Scaffolds for Novel Nerve Interfaces", 64th American Vacuum Society Interna-tional Symposium and Exhibition, Tampa, FL, 2017.
Velez, C., Z. I. Gonzalez, J. F. Osma, and D. P. Arnold, "Sub-millimeter electropermanent magnets for microgrippers", Proc. 2017 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS 2017), Montreal, Canada, 07/2017.
2018
Peng, C., H. Lai, M. E. Orazem, and S. Moghaddam, "Microstructure of clay fabric in electrokinetic dewatering of phosphatic clay dispersions", Applied Clay Science, vol. 158, pp. 94 - 101, Jan-06-2018.
Struk, P., A. Billard, S. Bargiel, Q. Tanguy, C. Gorecki, R. Chutani, N. Passilly, and H. Xie, "The SS-OCT endomicroscopy probe based on MOEMS Mirau micro-interferometer for early stomach cancer detection", Optical Micro- and NanometrologyOptical Micro- and Nanometrology VII, Strasbourg, France, SPIE, 2018.
Spearman, B. S., V. H. Desai, S. Mobini, M. D. McDermott, J. B. Graham, K. J. Otto, J. W. Judy, and C. E. Schmidt, "Tissue-Engineered Peripheral Nerve Interfaces", Advanced Functional Materials, vol. 28, issue 12, pp. 1701713, Mar-28-2018.
2019
Zhou, H., D. A. Mills, A. Vera, A. Garraud, W. Oates, and M. Sheplak, "A High-Temperature Optical Sapphire Pressure Sensor For Harsh Environments", AIAA Scitech 2019 Forum, San Diego, CaliforniaReston, Virginia, American Institute of Aeronautics and Astronautics, 2019.
2021
Heidari, H., M. Ozturk, R. Ghannam, M-K. Law, H. Khanbareh, and M. A. Halim, "IEEE Access Special Section Editorial: Energy Harvesting Technologies for Wearable and Implantable Devices", IEEE Access, vol. 9, pp. 91324 - 91327, Jan-01-2021.
Kagan, C. R., D. P. Arnold, M. G. Allen, and R. H. Olsson, "IoT4Ag: MEMS-Enabled Distributed Sensing, Communications, And Information Systems for The Internet Of Things For Precision Agriculture", 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS), virtual, IEEE, 2021.