Title | Micromachined wiring board with integrated microinductor for chip-scale power conversion |
Publication Type | Journal Article |
Year of Publication | 2014 |
Authors | Meyer, C. D., S. S. Bedair, B. C. Morgan, and D. P. Arnold |
Journal | IEEE Trans. Power Electron |
Volume | 29 |
Start Page | 6052-6063 |
Date Published | Nov. 2014 |
Other Numbers | ISSN : 0885-8993 |
Keywords | DC–DC power converters, integrated circuit, packaging micromachining, thick-film inductors |
DOI | 10.1109/TPEL.2013.2296507 |