A Flush-Mount Sensor Package for a MEMS Piezoelectric Microphone with Through-Silicon-Vias for Aircraft Fuselage Arrays

TitleA Flush-Mount Sensor Package for a MEMS Piezoelectric Microphone with Through-Silicon-Vias for Aircraft Fuselage Arrays
Publication TypeConference Proceedings
Year of Conference2016
AuthorsReagan, T., J. R. Underbrink, J. Meloy, and M. Sheplak
Conference NameHilton Head 2016 Workshop