A method to form bonded micromagnets embedded in silicon

TitleA method to form bonded micromagnets embedded in silicon
Publication TypeConference Paper
Year of Publication2007
AuthorsBowers, B., J. Agashe, and D. P. Arnold
Conference NameProc. 14th Int. Conf. Solid-State Sensors, Actuators, and Microsystems (Transducers 07)
Date PublishedJune
Abstract

{In this work, samarium cobalt (SmCo) powder is utilized for the fabrication of micromagnetic structures embedded in silicon wafers. The fabrication process involves the dry packing of raw, magnetic powder (mean particle diameter of 5-10

URLhttp://dx.doi.org/10.1109/SENSOR.2007.4300450
DOI10.1109/SENSOR.2007.4300450