| Title | Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer |
| Publication Type | Conference Paper |
| Year of Publication | 2003 |
| Authors | Xie, H., Z. Pan, W. Frey, and G. K. Fedder |
| Conference Name | Proc. of the 2003 Nanotechnology Conference |
| Conference Location | San Francisco, CA, USA |
| Keywords | 3-axis, Accelerometer, CMOS-MEMS |
| Abstract | This paper reports a novel single structure, three-axis sensing accelerometer based on post-CMOS process. The resultant device incorporates both thin-film structures and bulk Si structures to achieve three-axis acceleration sensing without extra front-side lithography, or wafer bonding, which are required by other CMOS three-axis accelerometers. Behavioral simulation using NODAS and FEM simulation were used to validate the design. The overall structure size is about 1mm by 1mm. Noise floor of 0.1 mG/rtHz is expected in all three axes. Characterization is ongoing. |
| URL | http://www.nsti.org/procs/Nanotech2003v2/9/M24.04 |
