Seahee Hwangbo

Chyczewski, S., S. Hwangbo, Y-K. Yoon, and D. P. Arnold, "Experimental demonstration of multi-watt wireless power transmission to ferrite-core receivers at 6.78 MHz", Wireless Power Transfer, vol. 6, issue 1, pp. 17 - 25, Jan-03-2019.

Kim, H-in., S. Hwangbo, R. Bowrothu, and Y-K. Yoon, "Highly Compact, Multiband Composite-Right/Left-Handed(CRLH) Transmission Line Based Stub for GPS Applications", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.

Hwangbo, S., R. Bowrothu, H-in. Kim, and Y-K. Yoon, "Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.

Velez, C., S. Hwangbo, S. T. Chyczewski, J. Ewing, R. Bowrothu, C. S. Smith, Y-K. Yoon, and D. P. Arnold, "Investigation of Ferromagnetic Resonance Shift in Screen-Printed Barium Ferrite/Samarium Cobalt Composites", IEEE Transactions on Microwave Theory and Techniques, vol. 67, issue 8, pp. 3230 - 3236, Jan-08-2019.

Bowrothu, R., S. Hwangbo, H. Kim, and Y-K. Yoon, "Quintuple Band Lambda/4 Stub by using Unbalanced Bridged CRLH Transmission Lines", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.

Velez, C., J. Ewing, S. Hwangbo, K. Sondhi, T. Schumann, Y. K. Yoon, and D. P. Arnold, "Low-Temperature Micropatterning of Thick-Film BaFe12O19 Composites on Semiconductor Substrates for Integrated Millimeter Wave Devices", 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Ann Arbor, MI, IEEE, 2018.

Clingenpeel, T., S. Hwangbo, N. Garraud, D. P. Arnold, and Y-K. Yoon, "Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2018.

Hwangbo, S., A. Rahimi, and Y-K. Yoon, "Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications", 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, USA, IEEE, 2017.

Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.

Fang, S-P., S. Hwangbo, H. An, and Y. K. Yoon, "Fabrication and Characterization of Nanoporous Metallic Interconnects Using Electrospun Nanofiber Template and Electrochemical Deposition", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.

Hwangbo, S., H. Yong Yang, and Y-K. Yoon, "Mutual Coupling Reduction Using Micromachined Complementary Meander-Line Slots for a Patch Array Antenna", IEEE Antennas and Wireless Propagation Letters, vol. 16, pp. 1667 - 1670, Feb-02-2017.

Yoon, Y. K., S. Hwangbo, T. Clingenpeel, and A. Rahimi, "Recent Advancement on Low Loss Meta-conductor Technology for Energy Effi-cient 5G and Millimeter Wave Applica-tions", 2017 Microprocessors and Nanotechnology Conference (MNC), Jeju, South Korea, 2017.

Wen, X., Y. Wang, S. Hwangbo, Y. K. Yoon, and D. P. Arnold, "Thick-film magnetic materials for integrated microwave systems", Napa Microsystems Workshop, Napa, CA, 2017.

Clingenpeel, T., A. Rahimi, S. Hwangbo, Y.-K. Yoon, and A. Shorey, "Fabrication and characterization of advanced through glass via interconnects", International Symposium on Microelectronics, vol. 2016, issue 1, pp. 000288 - 000292, Feb-10-2016.

Hwangbo, S., Y.-K. Yoon, and A. Shorey, "Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications", 2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Fajardo, PR, USA, IEEE, 2016.

Hwangbo, S., A. B. Shorey, and Y.-K. Yoon, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.