Publications

Found 2 results
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F
Fang, S-P., S. Hwangbo, H. An, and Y. K. Yoon, "Fabrication and Characterization of Nanoporous Metallic Interconnects Using Electrospun Nanofiber Template and Electrochemical Deposition", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
D
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.