Publications

Found 214 results
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W
Nishida, T., "Wireless Implantable Recording Electrodes (FWIRE) for Brain Machine Interfaces", IEEE International Symposium on Circuits and Systems, 2007 (ISCAS 2007), pp. 2084 , May, 2007.
Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.
Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.
Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.
Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3197, Hilton Head, SC, May, 2003.
Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", J. Acoust. Soc. Am., vol. 115, no. 2, pp. 757-767, MAR, 2004.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
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Cheng, S., R. Sathe, R. D. Natarajan, and D. P. Arnold, "A Voltage-Multiplying Self-Powered AC/DC Converter with 0.35 V Minimum Input Voltage for Energy Harvesting Applications", Applied Power Electronics Conf. & Exposition (APEC 2011), Fort Worth, TX, pp. 1311-1318, 03/2011.
Cheng, S., R. Sathe, R. D. Natarajan, and D. P. Arnold, "A Voltage-Multiplying Self-Powered AC/DC Converter with 0.35 V Minimum Input Voltage for Energy Harvesting Applications", IEEE Transactions on Power Electronics, vol. 26, no. 9, pp. 2542-2549, 09/2011.
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Gu, P., T. Nishida, and H. Fan, "The use of polyurethane as an elastomer in thermoplastic microfluidic devices and the study of its creep properties", ELECTROPHORESIS, vol. 35, issue 2-3, pp. 289 - 297, 02/2014, 2013.
Thompson, S., G-Y. Sun, Y. Choi, and T. Nishida, "Uniaxial Process Induced Strained Si: Extending the CMOS Roadmap", IEEE Trans. Electron Dev., vol. 53, pp. 1010-1020, MAY, 2006.
Schultz, T., L. Cattafesta, T. Nishida, and M. Sheplak, "Uncertainty Analysis of the Two-Microphone Method", 8th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2002-2465, June, 2002.
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Thompson, S., and T. Nishida, "Tunneling and thermal emission of electrons from a distribution of shallow traps in SiO2", Applied Physics Letters, vol. 58, pp. 1262-1264, DEC, 1991.
Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A Tunable Electromechanical Helmholtz Resonator", 9th AIAA/CEAS Aeroacoustics Conference and Exhibit, AIAA Paper 2003-3145, Hilton Head, SC, May, 2003.
Nishida, T., "TSensors Vision: Enabling Sustainable Solutions for the Global Environment through Novel Sensing", MEMS & Sensors Executive Congress, 2016.
Siauw, W. Long, J-P. Bonnet, J. Tensi, L. Cordier, B. Noack, and L. Cattafesta, "Transient dynamics of the flow around a NACA 0015 airfoil using fluidic vortex generators ", International Journal of Heat and Fluid Flow, vol. 31, issue 3, pp. 450-459, 06/2010.
Liao, W., E. Xia Zhang, M. L. Alles, C. Xuan Zhang, H. Gong, K. Ni, A. L. Sternberg, H. Xie, D. M. Fleetwood, R. A. Reed, et al., "Total-Ionizing-Dose Effects on Piezoelectric Micromachined Ultrasonic Transducers", IEEE Transactions on Nuclear Science, vol. 64, issue 1, pp. 233 - 238, Nov-22-2016, 2017.
Park, H. W., S. K. Dixit, Y. Choi, R. D. Schrimpf, E. Filangeri, T. Nishida, and S. Thompson, "Total Ionizing Dose Effects on Strained HfO2-based nMOSFETs", IEEE Transactions on Nuclear Science, vol. 55, pp. 2981-2985, DEC, 2008.
Streit, W. J., Q-S. Xue, A. Prasad, V. Sankar, E. Knott, A. T. Dyer, J. R. Reynolds, T. Nishida, G. Shaw, and J. C. Sanchez, "Tissue, Electrical, and Material Responses in Electrode Failure", IEEE Pulse, vol. 3, issue 1, pp. 30 - 33, 01/2012.
Walters, G., A. Shekhawat, N. G. Rudawski, S. Moghaddam, and T. Nishida, Tiered deposition of sub-5 nm ferroelectric Hf1-xZrxO2 films on metal and semiconductor substrates, 2018.
Walters, G., A. Shekhawat, N. G. Rudawski, S. Moghaddam, and T. Nishida, "Tiered deposition of sub-5 nm ferroelectric Hf 1-x Zr x O 2 films on metal and semiconductor substrates", Applied Physics Letters, vol. 112, issue 19, pp. 192901, Jul-05-2018.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.