Publications

Found 55 results
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Hwangbo, S., Y.-K. Yoon, and A. Shorey, "Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications", 2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Fajardo, PR, USA, IEEE, 2016.
Hwangbo, S., A. Rahimi, and Y-K. Yoon, "Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications", 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, USA, IEEE, 2017.
Hwangbo, S., A. B. Shorey, and Y.-K. Yoon, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Hwangbo, S., H. Yong Yang, and Y-K. Yoon, "Mutual Coupling Reduction Using Micromachined Complementary Meander-Line Slots for a Patch Array Antenna", IEEE Antennas and Wireless Propagation Letters, vol. 16, pp. 1667 - 1670, Feb-02-2017.
Hwangbo, S., R. Bowrothu, H-in. Kim, and Y-K. Yoon, "Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.
Hsu, K-H., S-P. Fang, C-L. Lin, Y-S. Liao, Y.-K. Yoon, and A. Chauhan, "Hybrid Electrospun Polycaprolactone Mats Consisting of Nanofibers and Microbeads for Extended Release of Dexamethasone", Pharmaceutical Research, vol. 33, issue 6, pp. 1509 - 1516, Jan-06-2016.
Hsu, A., C. Cowan, W. Chu, B. McCoy, A. Wong-Foy, R. Pelrine, C. Velez, D. P. Arnold, J. Lake, J. Ballard, et al., "Automated 2D micro-assembly using diamagnetically levitated milli-robots", 2017 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS), Montreal, QC, IEEE, 2017.
Hsu, C-H., T. Nishida, and C-T. Sah, "Observation of threshold oxide electric field for trap generation in oxide films on silicon", Journal of Applied Physics, vol. 63, no. 12, pp. 5882-5884, DEC, 1988.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Characterization of Compliant-Backplate Helmholtz Resonators for an Electromechanical Acoustic Liner", 40th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2002-0666, Reno, NV, January, 2002.
Horowitz, S., M. Sheplak, L. Cattafesta, and T. Nishida, "MEMS Acoustic Energy Harvester", 5th International Workshop on Micro Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2005), Tokyo, Japan, November, 2005.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor", 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1042, Reno, NV, January, 2004.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Development of a micromachined piezoelectric microphone for aeroacoustics applications", J. Acoust. Soc. Am., vol. 122, no. 6, pp. 3428-3436, DEC, 2007.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Piezoelectric Microphone for Aeroacoustics Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2006.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Compliant-Backplate Helmholtz Resonators for Active Noise Control Applications", 39th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2001-0817, Reno, NV, January, 2001.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Design and Characterization of a Micromachined Piezoelectric Microphone", 11th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2005-2998, May, 2005.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Characterization of Compliant-Backplate Helmholtz Resonators for an Electromechanical Acoustic Liner", International Journal of Aeroacoustics, vol. 1, no. 2, pp. 183-205, APR, 2002.
Horowitz, S., T-A. Chen, L. Cattafesta, M. Sheplak, T. Nishida, and V. Chandrasekaran, "Optical Flow Sensor Using Geometric Moire Interferometry", 34th International Conference on Environmental Systems, SAE Paper 2004-01-2267, Colorado Springs, CO, July, 2004.
Horowitz, S., M. Sheplak, L. Cattafesta, and T. Nishida, "A MEMS Acoustic Energy Harvester", J. Micromech. Microeng., vol. 16, pp. S174-S181, SEP, 2006.
Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.
Horner, D., S. Ravi, and S. Moghaddam, "Empirical Verification of Theoretical Models on Performance Characteristics of Micro-Pillar Wick Structures", ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, Sapporo, Japan, 06/2013.
Horner, D., S. Ravi, and S. Moghaddam, "Monoporous micropillar wick structures, II-optimization & theoretical limits", Applied Thermal Engineering, vol. 73, issue 1, pp. 1378 - 1386, Jan-12-2014.
Homeijer, B., L. Cattafesta, T. Nishida, and M. Sheplak, "Design of a MEMS Piezoresistive Microphone for use in Aeroacoustic Measurements", 13th AIAA/CEAS Aeroacoustics Conference and Exhibit, Rome, Italy, May, 2007.
Homeijer, B., B. A. Griffin, M. D. Williams, B. V. Sankar, and M. Sheplak, "Composite Circular Plates with Residual Tensile Stress Undergoing Large Deflections", Journal of Applied Mechanics, vol. 79, no. 2: ASME, 03/2012.