Publications

Found 55 results
[ Author(Asc)] Title Type Year
Filters: First Letter Of Last Name is H  [Clear All Filters]
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 
H
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Hwangbo, S., H. Yong Yang, and Y-K. Yoon, "Mutual Coupling Reduction Using Micromachined Complementary Meander-Line Slots for a Patch Array Antenna", IEEE Antennas and Wireless Propagation Letters, vol. 16, pp. 1667 - 1670, Feb-02-2017.
Hwangbo, S., R. Bowrothu, H-in. Kim, and Y-K. Yoon, "Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.
Hwangbo, S., Y.-K. Yoon, and A. Shorey, "Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications", 2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Fajardo, PR, USA, IEEE, 2016.
Hwangbo, S., A. Rahimi, and Y-K. Yoon, "Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications", 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, USA, IEEE, 2017.
Hwangbo, S., A. B. Shorey, and Y.-K. Yoon, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
Hsu, K-H., S-P. Fang, C-L. Lin, Y-S. Liao, Y.-K. Yoon, and A. Chauhan, "Hybrid Electrospun Polycaprolactone Mats Consisting of Nanofibers and Microbeads for Extended Release of Dexamethasone", Pharmaceutical Research, vol. 33, issue 6, pp. 1509 - 1516, Jan-06-2016.
Hsu, A., C. Cowan, W. Chu, B. McCoy, A. Wong-Foy, R. Pelrine, C. Velez, D. P. Arnold, J. Lake, J. Ballard, et al., "Automated 2D micro-assembly using diamagnetically levitated milli-robots", 2017 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS), Montreal, QC, IEEE, 2017.
Hsu, C-H., T. Nishida, and C-T. Sah, "Observation of threshold oxide electric field for trap generation in oxide films on silicon", Journal of Applied Physics, vol. 63, no. 12, pp. 5882-5884, DEC, 1988.
Horowitz, S., M. Sheplak, L. Cattafesta, and T. Nishida, "MEMS Acoustic Energy Harvester", 5th International Workshop on Micro Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2005), Tokyo, Japan, November, 2005.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor", 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1042, Reno, NV, January, 2004.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Development of a micromachined piezoelectric microphone for aeroacoustics applications", J. Acoust. Soc. Am., vol. 122, no. 6, pp. 3428-3436, DEC, 2007.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Piezoelectric Microphone for Aeroacoustics Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2006.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Compliant-Backplate Helmholtz Resonators for Active Noise Control Applications", 39th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2001-0817, Reno, NV, January, 2001.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Design and Characterization of a Micromachined Piezoelectric Microphone", 11th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2005-2998, May, 2005.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Characterization of Compliant-Backplate Helmholtz Resonators for an Electromechanical Acoustic Liner", International Journal of Aeroacoustics, vol. 1, no. 2, pp. 183-205, APR, 2002.
Horowitz, S., T-A. Chen, L. Cattafesta, M. Sheplak, T. Nishida, and V. Chandrasekaran, "Optical Flow Sensor Using Geometric Moire Interferometry", 34th International Conference on Environmental Systems, SAE Paper 2004-01-2267, Colorado Springs, CO, July, 2004.
Horowitz, S., M. Sheplak, L. Cattafesta, and T. Nishida, "A MEMS Acoustic Energy Harvester", J. Micromech. Microeng., vol. 16, pp. S174-S181, SEP, 2006.
Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "Characterization of Compliant-Backplate Helmholtz Resonators for an Electromechanical Acoustic Liner", 40th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2002-0666, Reno, NV, January, 2002.
Horner, D., S. Ravi, and S. Moghaddam, "Empirical Verification of Theoretical Models on Performance Characteristics of Micro-Pillar Wick Structures", ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, Sapporo, Japan, 06/2013.
Horner, D., S. Ravi, and S. Moghaddam, "Monoporous micropillar wick structures, II-optimization & theoretical limits", Applied Thermal Engineering, vol. 73, issue 1, pp. 1378 - 1386, Jan-12-2014.
Homeijer, B., B. A. Griffin, M. D. Williams, B. V. Sankar, and M. Sheplak, "Composite Circular Plates with Residual Tensile Stress Undergoing Large Deflections", Journal of Applied Mechanics, vol. 79, no. 2: ASME, 03/2012.
Homeijer, B., L. Cattafesta, T. Nishida, and M. Sheplak, "Design of a MEMS Piezoresistive Microphone for use in Aeroacoustic Measurements", 13th AIAA/CEAS Aeroacoustics Conference and Exhibit, Rome, Italy, May, 2007.