Publications

Found 15 results
Author Title Type [ Year(Asc)]
Filters: First Letter Of Last Name is C and Author is Venkataraman Chandrasekaran  [Clear All Filters]
2004
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor", 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1042, Reno, NV, January, 2004.
Horowitz, S., T-A. Chen, L. Cattafesta, M. Sheplak, T. Nishida, and V. Chandrasekaran, "Optical Flow Sensor Using Geometric Moire Interferometry", 34th International Conference on Environmental Systems, SAE Paper 2004-01-2267, Colorado Springs, CO, July, 2004.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
2003
Chandrasekaran, V., B. V. Sankar, L. Cattafesta, T. Nishida, and M. Sheplak, "An Analytical Model for Thermoelastic Actuation of Composite Diaphragms", 12th International Conference on Solid-State Sensors and Actuators, Boston, MA, pp. 1844-1847, June, 2003.
Kang, B., S. Kim, J. Kim, F. Ren, K. Baik, S. J. Pearton, B. P. Gila, C. Abernathy, C. Pan, G. Chen, et al., "Effect of External Strain on the Conductivity of AlGaN/GaN High-Electron-Mobility Transistors", Applied Physics Letters, vol. 83, no. 23, pp. 4845-4847, DEC, 2003.
2002
Chow, E., A. Partridge, V. Chandrasekaran, M. Sheplak, T. Nishida, C. Quate, and T. Kenny, "Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.
Chandrasekaran, V., M. Sheplak, L. Cattafesta, and B. V. Sankar, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
2001
Chandrasekaran, V., A. Cain, T. Nishida, L. Cattafesta, and M. Sheplak, "Characterization of a Micromachined Thermal Shear Stress Sensor", 39th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2001-0247, Reno, NV, January, 2001.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
2000
Chandrasekaran, V., A. Cain, T. Nishida, and M. Sheplak, "Dynamic Calibration Technique for Thermal Shear Stress Sensors with Variable Mean Flow", 38th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2000-0508, Reno, NV, January, 2000.