Publications

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Wang, M., J. Li, K. Ngo, and H. Xie, "Silicon Molding Techniques for Integrated Power MEMS Inductors", Sensors & Actuators: A. Physical, 2010.
Wang, M., K. Ngo, I. Batarseh, and H. Xie, "Integrated Power Inductor with Silicon Substrate Molding", 2006 Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT’06)., Singapore, 06/2006.
Wang, M., I. Batarseh, K. Ngo, and H. Xie, "Design and Fabrication of Integrated Power Inductor Based on Silicon Molding Technology", Proc. of the 38th Annual IEEE Power Electronics Specialists Conference (PESC'07), Orlando, FL, IEEE, 06/2007.
Wang, M., K. Ngo, and H. Xie, "SU8 Enhanced High Power Density MEMS Inductors", Proc. of the 34th Annual Conference of the IEEE Industrial Electronics Society (IECON’08), Orlando, FL, USA, Nov. 10-13, 2008.
Wang, M., J. Li, K. Ngo, and H. Xie, "A novel integrated power inductor in silicon substrate for ultra-compact power supplies", 2010 IEEE Applied Power Electronics Conference and Exposition - APEC 20102010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Palm Springs, CA, USA, IEEE, pp. 2036 - 2041, 2010.
Wang, M., J. Li, K. Ngo, and H. Xie, "A Surface Mountable Micro-Fabricated Power Inductor in Silicon for Ultra-Compact Power Supplies", IEEE Transactions on Power Electronics, 2010.