Publications

Found 167 results
Author Title [ Type(Desc)] Year
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Journal Article
Li, X., R. Wu, M. Sheplak, and J. Li, "Multi-Frequency CW-Based Time Delay Estimation for Proximity Ultrasonic Sensors", IEE Proceedings: Radar, Sonar, and Navigation, vol. 149, no. 02, pp. 53-59, JUL, 2002.
Guo, B., J. Li, H. Zmuda, and M. Sheplak, "Multifrequency Microwave-Induced Thermal Acoustic Imaging for Breast Cancer Detection", IEEE Trans. Bio. Eng., vol. 54, no. 11, pp. 2000-2010, NOV, 2007.
Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A multiple degree of freedom electromechanical Helmholtz resonator", J. Acoust. Soc. Am., vol. 122, no. 1, pp. 291-301, JUL, 2007.
Liu, J., D. Martin, K. Kadirvel, T. Nishida, L. Cattafesta, M. Sheplak, and B. Mann, "Nonlinear Model and System Identification of a Capacitive Dual-Backplate MEMS Microphone", J. Sound Vib., vol. 309, no. 1-2, pp. 276-292, JAN, 2008.
Papila, M., M. Sheplak, and L. Cattafesta, "Optimization of Clamped Circular Piezoelectric Composite Actuators", Sensors & Actuators A, vol. 147, no. 1, pp. 310-323, SEP, 2008.
Mathew, J., Q. Song, B. V. Sankar, M. Sheplak, and L. Cattafesta, "Optimized Design of Piezoelectric Flap Actuators for Active Flow Control", AIAA Journal, vol. 44, no. 12, pp. 2919-2928, SEP, 2006.
Rogers, J. E., Y-K. Yoon, M. Sheplak, and J. W. Judy, "A Passive Wireless Microelectromechanical Pressure Sensor for Harsh Environments", Journal of Microelectromechanical Systems, vol. 27, issue 1, pp. 73 - 85, Jan-02-2018.
Li, X., E. Larsson, M. Sheplak, and J. Li, "Phase-Shift Based Time-Delay Estimators for Proximity Acoustic Sensors", IEEE Journal of Oceanic Engineering, vol. 27, no. 1, pp. 47-56, JUL, 2002.
Papila, M., R. T. Haftka, T. Nishida, and M. Sheplak, "Piezoresistive Microphone Design Pareto Optimization: Tradeoff between Sensitivity and Noise Floor", J. Microelectromechanical Systems, vol. 15, no. 6, pp. 1632-1643, DEC, 2006.
Chow, E., A. Partridge, V. Chandrasekaran, M. Sheplak, T. Nishida, C. Quate, and T. Kenny, "Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.
Dieme, R., J. Zhang, N. G. Rudawski, K. Jones, G. Bosman, M. Sheplak, and T. Nishida, "Process Dependence of 1/f Noise and Defects in Ion Implanted p-Type Piezoresistors", Journal of Applied Physics, vol. 112, 2012.
Sheplak, M., E. Spina, and C. McGinley, "Progress in Hot-Film Anemometry for Hypersonic Flow", Experimental Thermal and Fluid Science, vol. 13, no. 1, pp. 21-28, JUL, 1996.
Dieme, R., G. Bosman, M. Sheplak, and T. Nishida, "Source of Excess Noise in Silicon Piezoresistive Microphones", J. Acoustical Society of America, vol. 119, pp. 2710-2720, MAY, 2006.
Griffin, B. A., V. Chandrasekaran, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Silicon Vias", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.
Schultz, T., M. Sheplak, and L. Cattafesta, "Uncertainty analysis of the two-microphone method", J. Sound Vib., vol. 304, no. 1-2, pp. 91-109, JUL, 2007.
Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", J. Acoust. Soc. Am., vol. 115, no. 2, pp. 757-767, MAR, 2004.
Thesis
Martin, D., "Design, fabrication, and characterization of a MEMS dual-backplate capacitive microphone", Deparment of Electrical and Computer Engineering, vol. Ph.D., Gainesville, University of Florida, pp. 250, 2007.