Publications

Found 1223 results
[ Author(Asc)] Title Type Year
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W
Wen, X., J. Starr, J. S. Andrew, and D. P. Arnold, "Electro-infiltration: a method to form nanocomposite soft magnetic cores for integrated magnetic devices", J. Micromech. Microeng., vol. 24, pp. ~4 pages, 09/2014.
Wen, X., J. S. Andrew, and D. P. Arnold, "Exchange-coupled hard magnetic Fe-Co/CoPt nanocomposite films fabricated by electro-infiltration", AIP Advances, vol. 7, issue 5, pp. 056225, Jan-05-2017.
Wen, X., J. S. Andrew, and D. P. Arnold, "Exchange-coupled hard magnetic Fe-Co/CoPt nanocomposite films fabricated by electro-infiltration", AIP Advances, vol. 7, issue 5, pp. 056225, 05/2017.
Wen, X., J. Starr, J. S. Andrew, and D. P. Arnold, "A scalable nanomanufacturing process for nanocomposite magnetic microstructures", Workshop on Enabling Nanofabrication for Rapid Innovation, Napa, CA, 05/2013.
Wen, X., S. J. Kelly, J. S. Andrew, and D. P. Arnold, "Nickel-zinc ferrite/permalloy (Ni0.5Zn0.5Fe2O4/Ni-Fe) soft magnetic nanocomposites fabricated by electro-infiltration", AIP Advances, vol. 6, issue 5, pp. 056111, 05/2016.
Wen, X., Y. Wang, S. Hwangbo, Y. K. Yoon, and D. P. Arnold, "Thick-film magnetic materials for integrated microwave systems", Napa Microsystems Workshop, Napa, CA, 2017.
Ward, K., and H. Z. Fan, "Mixing in microfluidic devices and enhancement methods", Journal of Micromechanics and Microengineering, vol. 25, issue 9, pp. 094001, 09/2015.
Wang, M., J. Li, K. Ngo, and H. Xie, "A novel integrated power inductor in silicon substrate for ultra-compact power supplies", 2010 IEEE Applied Power Electronics Conference and Exposition - APEC 20102010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Palm Springs, CA, USA, IEEE, pp. 2036 - 2041, 2010.
Wang, D., X. Han, H. Liu, Q. Chen, W. Wang, and H. Xie, "Portable Fourier transform infrared spectrometer based on an electrothermal MEMS mirror", 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Kaohsiung, IEEE, 2017.
Wang, W., J. Chen, A. Zivkovic, and H. Xie, "A Fourier Transform Spectrometer Based on an Electrothermal MEMS Mirror with Improved Linear Scan Range", Sensors, vol. 16, issue 10, pp. 1611, Jan-10-2016.
Wang, D., H. Liu, J. Zhang, Q. Chen, W. Wang, X. Zhang, and H. Xie, "Fourier transform infrared spectrometer based on an electrothermal MEMS mirror", Applied Optics, vol. 57, issue 21, pp. 5956, Jan-01-2018.
Wang, D., P. Liang, S. Samuelson, H. Jia, J. Ma, and H. Xie, "Correction of image distortions in endoscopic optical coherence tomography based on two-axis scanning MEMS mirrors", Biomedical Optics Express, vol. 4, issue 10, pp. 2066, 2013.
Wang, W., J. Chen, Q. Tanguy, and H. Xie, "A Monolithic Michelson interferometer with a large piston MEMS micromirror", 2016 International Conference on Optical MEMS and Nanophotonics (OMN), Singapore, Singapore, IEEE, 2016.
Wang, W., J. Chen, A.S. Zivkovic, C. Duan, and H. Xie, "A silicon based Fourier transform spectrometer base on an open-loop controlled electrothermal MEMS mirror", TRANSDUCERS 2015 - 2015 18th International Solid-State Sensors, Actuators and Microsystems Conference2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Anchorage, AK, USA, IEEE, pp. 212 - 215, 7/2015.
Wang, Z., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Constant-Beamwidth and Constant-Powerwidth Wideband Robust Capon Beamformers for Acoustic Imaging", J. Acoust. Soc. Am., vol. 116, no. 3, pp. 1621-1631, SEP, 2004.
Wang, H., Y. Ma, H. Yang, H. Jiang, Y. Ding, and H. Xie, "MEMS Ultrasound Transducers for Endoscopic Photoacoustic Imaging Applications", Micromachines, vol. 11, issue 10, pp. 928, Jan-10-2020.
Wang, D., X. Zhang, L. Zhou, M. Liang, D. Zhang, and H. Xie, "An ultra-fast electrothermal micromirror with bimorph actuators made of copper/tungsten", 2017 International Conference on Optical MEMS and Nanophotonics (OMN)2017 International Conference on Optical MEMS and Nanophotonics (OMN), Santa Fe, NM, USA, IEEE, 2017.
Wang, D., C. A. Watkins, S. Koppal, and H. Xie, A silicon optical bench with vertically-oriented micromirrors for active beam steering, 2019.
Wang, D., S. Strassle Rojas, A. Shuping, Z. Tasneem, S. Koppal, and H. Xie, "An Integrated Forward-View 2-Axis Mems Scanner for Compact 3D Lidar", 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Singapore, Singapore, IEEE, 2018.
Wang, W., J. Chen, A. S. Zivkovic, Q. A. A. Tanguy, and H. Xie, "A Compact Fourier Transform Spectrometer on a Silicon Optical Bench With an Electrothermal MEMS Mirror", Journal of Microelectromechanical Systems, vol. 25, no. 2, pp. 347-355, 04/2016.
Wang, Z., H. Adler, D. Chan, A. Jain, H. Xie, Z.L. Wu, and Y. Pan, "Cystoscopic optical coherence tomography for urinary bladder imaging in vivo", Coherence Domain Optical Methods and Optical Coherence Tomography in Biomedicine XProceedings of SPIE, vol. 6079, San Jose, CA, USA, SPIE, pp. 60790J - 60790J-9, 2006.
Wang, D., C. A. Watkins, and H. Xie, "MEMS Mirrors for LiDAR: A Review", Micromachines, vol. 11, issue 5, pp. 456, Jan-05-2020.
Wang, D., C. Duan, X. Zhang, Z. Yun, A. Pozzi, and H. Xie, "Common-path optical coherence tomography using a microelectromechanical-system-based endoscopic probe", Applied Optics, vol. 55, issue 25, pp. 6930, Jan-01-2016.
Wang, H., L. Zhou, X. Zhang, and H. Xie, "Thermal Reliability Study of an Electrothermal MEMS Mirror", IEEE Transactions on Device and Materials Reliability, pp. 1 - 1, Jan-01-2018.
Wang, D., C. Watkins, S. Koppal, M. Li, Y. Ding, and H. Xie, "A Compact Omnidirectional Laser Scanner Based on an Electrothermal Tripod Mems Mirror for Lidar Please Leave", 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Berlin, Germany, IEEE, 2019.