Publications
"Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.
, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
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