Publications

Found 4 results
Author Title [ Type(Desc)] Year
Filters: Author is Clingenpeel, Timothy  [Clear All Filters]
Conference Paper
Yoon, Y. K., S. Hwangbo, T. Clingenpeel, and A. Rahimi, "Recent Advancement on Low Loss Meta-conductor Technology for Energy Effi-cient 5G and Millimeter Wave Applica-tions", 2017 Microprocessors and Nanotechnology Conference (MNC), Jeju, South Korea, 2017.
Clingenpeel, T., and Y-K. Yoon, "Reliability of Cu/NiFe and Cu/Ni Metaconductor Devices for RF Applications", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Clingenpeel, T., S. Hwangbo, N. Garraud, D. P. Arnold, and Y-K. Yoon, "Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2018.
Journal Article
Clingenpeel, T., A. Rahimi, S. Hwangbo, Y.-K. Yoon, and A. Shorey, "Fabrication and characterization of advanced through glass via interconnects", International Symposium on Microelectronics, vol. 2016, issue 1, pp. 000288 - 000292, Feb-10-2016.