Publications

Found 214 results
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Conference Paper
Prasad, A., Q-S. Xue, V. Sankar, T. Nishida, G. Shaw, W. J. Streit, and J. C. Sanchez, "Predicting Microelectrode Array Functionality Using Biotic and Abiotic Metrics in Vivo", 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, San Diego, CA, Aug 28-Sep 1, 2012.
Kurdila, A., B. Carroll, T. Nishida, and M. Sheplak, "Reduced Order Modeling for Low Reynolds Number Flow Control", Proceedings of SPIEs 6th Annual International Symposium on Smart Structures and Materials, Mathematics Modeling and Control Conference, vol. 3667, Newport Beach, CA, pp. 68-79, March, 1999.
Wang, Z., J. Li, T. Nishida, and M. Sheplak, "Robust Capon Beamformers for Wideband Acoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3198, Hilton Head, SC, May, 2003.
Saini, R., S. Bhardwaj, T. Nishida, and M. Sheplak, "Scaling Relations for Piezoresistive Microphones", International Mechanical Engineering Congress and Exposition, Orlando, FL, November, 2000.
Smith, C. S., K. Sondhi, B. Y. Jimenez, H. Z. Fan, T. Nishida, and D. P. Arnold, "Screen-printed inductive silver ink strain sensor on stretchable TPU substrate", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Virtual, 2020.
Kadirvel, S., F. Liu, S. Horowitz, T. Nishida, K. Ngo, L. Cattafesta, and M. Sheplak, "A Self-Powered Wireless Active Acoustic Liner", 12th AIAA/CEAS Aeroacoustics Conference, Cambridge, MA, May, 2006.
Kadirvel, S., F. Liu, S. Horowitz, T. Nishida, K. Ngo, L. Cattafesta, and M. Sheplak, "A Self-Powered Wireless Active Acoustic Liner", 12th AIAA/CEAS Aeroacoustics Conference, Cambridge, MA, May, 2006.
Bhardwaj, S., M. Sheplak, and T. Nishida, "S/N Optimization and Noise Considerations for Piezoresistive Microphones", 16th International Conference on Noise in Physical Systems and 1/f Fluctuations, Gainesville, FL, World Scientific, pp. 549-552, October, 2001.
Suthram, S., Y. Sun, P. Majhi, I. Ok, H. Kim, H. R. Harris, N. Goel, S. Parthasarathy, A. D. Koehler, A. Acosta, et al., "Strain Additivity in III-V Channels for CMOSFETs beyond 22nm Technology Node", 2008 VLSI Symposium on VLSI Technology, pp. 182-183, October, 2008.
Ok, I., K. Akarvardar, S. Lin, M. Baykan, C.D. Young, P.Y. Hung, M.P. Rodgers, S. Bennett, H.O. Stamper, D.L. Franca, et al., "Strained SiGe and Si FinFETs for High Performance Logic with SiGe/Si Stack on SOI", International Electron Devices Meeting, San Francisco, CA, IEEE, 2010.
Wang, M., K. Ngo, and H. Xie, "SU8 Enhanced High Power Density MEMS Inductors", Proc. of the 34th Annual Conference of the IEEE Industrial Electronics Society (IECON’08), Orlando, FL, USA, Nov. 10-13, 2008.
Martin, D., K. Kadirvel, J. Liu, R. M. Fox, M. Sheplak, and T. Nishida, "Surface and Bulk Micromachined Dual Back-Plate Condenser Microphone", 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami, FL, January, 2005.
Martin, D., K. Kadirvel, T. Nishida, and M. Sheplak, "A Surface Micromachined Capacitive Microphone for Aeroacoustic Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2008.
Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.
Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.
Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.
Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A Tunable Electromechanical Helmholtz Resonator", 9th AIAA/CEAS Aeroacoustics Conference and Exhibit, AIAA Paper 2003-3145, Hilton Head, SC, May, 2003.
Schultz, T., L. Cattafesta, T. Nishida, and M. Sheplak, "Uncertainty Analysis of the Two-Microphone Method", 8th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2002-2465, June, 2002.
Cheng, S., R. Sathe, R. D. Natarajan, and D. P. Arnold, "A Voltage-Multiplying Self-Powered AC/DC Converter with 0.35 V Minimum Input Voltage for Energy Harvesting Applications", Applied Power Electronics Conf. & Exposition (APEC 2011), Fort Worth, TX, pp. 1311-1318, 03/2011.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.