Publications

Found 9 results
Author Title [ Type(Desc)] Year
Filters: First Letter Of Title is T and Author is Mark Sheplak  [Clear All Filters]
Conference Paper
Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.
Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.
Chandrasekaran, V., M. Sheplak, L. Cattafesta, and B. V. Sankar, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A Tunable Electromechanical Helmholtz Resonator", 9th AIAA/CEAS Aeroacoustics Conference and Exhibit, AIAA Paper 2003-3145, Hilton Head, SC, May, 2003.
McGinley, C., E. Spina, and M. Sheplak, "Turbulence Measurements in a Mach 11 Helium Boundary Layer", 25th AIAA Fluid Dynamics Conference, AIAA Paper 94-2364, Colorado Springs, CO, June, 1994.
Prasad, S., B. V. Sankar, L. Cattafesta, S. Horowitz, Q. Gallas, and M. Sheplak, "Two-Port Electroacoustic Model of an Axisymmetric Piezoelectric Composite Plate", 43rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, AIAA Paper 2002-1365, April, 2002.
Journal Article
Griffin, B. A., V. Chandrasekaran, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Silicon Vias", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.