Publications
Found 3 results
[ Author] Title Type Year Filters: First Letter Of Title is T and Author is Venkataraman Chandrasekaran [Clear All Filters]
"Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.
, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
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