Publications

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Heymann, D., C. D. Meyer, N. Jankowski, and B. C. Morgan, "Performance Modeling of Thermoelectric Generators as a Function of System Thermal Management", PowerMEMS, Washington, DC, Technical Digest of the 9th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, 12/2009.
Wang, Y., R. Bowrothu, Y-K. Yoon, and D. P. Arnold, "Patterning of thick electroplated CoPt magnets using SU-8 micromoulds", Micro & Nano Letters, vol. 14, issue 14, pp. 1393 - 1396, Jun-12-2020, 2019.
Rogers, J. E., Y-K. Yoon, M. Sheplak, and J. W. Judy, "A Passive Wireless Microelectromechanical Pressure Sensor for Harsh Environments", Journal of Microelectromechanical Systems, vol. 27, issue 1, pp. 73 - 85, Jan-02-2018.
Sells, J., V. Chandrasekharan, H. Zmuda, M. Sheplak, and D. P. Arnold, "Passive Wireless Direct Shear Stress Measurement", Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, SC, pp. 368-371, 06/2010.
Palavicini, M., B. George, and L. Cattafesta, "Passive Flow Control over a Three-Dimensional Turret with a Flat Aperture", 41st AIAA Fluid Dynamics Conference and Exhibit, Honolulu, Hawaii, AIAA, 07/2011.
Shetye, S., I. Eskinazi, and D. P. Arnold, "Part-to-Part and Part-to-Substarte Magnetic Self-Assembly of Millimeter Scale Components with Angular Orientation", Tech. Dig. 22nd IEEE Int. Conf. MicroElectro Mechanical Systems (MEMS 2009), Sorrento, Italy, pp. 669-672, January, 2009.
Yu, D., J. Chung, and S. Moghaddam, "Parametric study of water vapor absorption into a constrained thin film of lithium bromide solution", International Journal of Heat and Mass Transfer, vol. 55, issue 21-22, pp. 5687 - 5695, Jan-10-2012.
Ravi, S., D. Horner, and S. Moghaddam, "Parametric Study of The Transport Properties of Wicking Micro-Pillar Arrays", ASME 2013 Summer Heat Transfer Conference, Minneapolis, MN, 2013.
Pal, S., and H. Xie, "A parametric dynamic compact thermal model of an electrothermally actuated micromirror", Journal of Micromechanics and Microengineering, vol. 19, no. 6, pp. 065007, 2009.