Publications

Bhanvadia, A. A., R. T. Farley, Y. Noh, and T. Nishida, "3D printing of hollow geometries using blocking liquid substitution stereolithography", Scientific Reports, vol. 13, issue 1, Jan-09-2023.

Walters, G., A. Shekhawat, N. G. Rudawski, S. Moghaddam, and T. Nishida, Tiered deposition of sub-5 nm ferroelectric Hf1-xZrxO2 films on metal and semiconductor substrates, 2018.

Walters, G., A. Shekhawat, J. Jones, S. Moghaddam, and T. Nishida, Effect of in situ hydrogen plasma on the ferroelectricity of hafnium zirconium oxide films, 2020.

Shekhawat, A., G. Walters, C. Chang Chung, Y. Liu, R. Garcia, J. Jones, T. Nishida, and S. Moghaddam, Effect of furnace annealing on the ferroelectricity of Hf0.5 Zr0.5O2 thin films, 2019.

Shekhawat, A., G. Walters, C. Chang Chung, Y. Liu, R. Garcia, J. Jones, T. Nishida, and S. Moghaddam, Effect of Forming Gas Furnace Annealing on the Ferroelectricity and Wake-Up Effect of Hf0.5Zr0.5O2 Thin Films, 2020.

Shekhawat, A., G. Walters, N. Yang, J. Guo, T. Nishida, and S. Moghaddam, Data retention and low voltage operation of Al2O3/Hf0.5Zr0.5O2 based ferroelectric tunnel junctions, 2020.

Nishida, T., "TSensors Vision: Enabling Sustainable Solutions for the Global Environment through Novel Sensing", MEMS & Sensors Executive Congress, 2016.

Nishida, T., "Mission Innovation: The Driver for Global Pollution Monitoring Node Today, Tomorrow and in 2025", Commercialization of Micro, Nano, and Emerging Technologies, 2016.

Wang, C-W., S. Augustine, T. Nishida, and Z.H. Fan, "Low-Power Electrically Controlled Thermoelastic Microfluidic Valve Array for Multiplexed Immunoassay", Hilton Head 2016 Workshop, 2016.

Z. Fan, H., S. Augustine, C. Wang, P. Gu, Z. Xia, and T. Nishida, "Electrically Controlled Thermoelastic Valve Array for Multiplexed Immunoassay", 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2016), 2016.

Nishida, T., "Wireless Implantable Recording Electrodes (FWIRE) for Brain Machine Interfaces", IEEE International Symposium on Circuits and Systems, 2007 (ISCAS 2007), pp. 2084 , May, 2007.

Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.

Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3197, Hilton Head, SC, May, 2003.

Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.

Schultz, T., L. Cattafesta, T. Nishida, and M. Sheplak, "Uncertainty Analysis of the Two-Microphone Method", 8th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2002-2465, June, 2002.

Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A Tunable Electromechanical Helmholtz Resonator", 9th AIAA/CEAS Aeroacoustics Conference and Exhibit, AIAA Paper 2003-3145, Hilton Head, SC, May, 2003.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.

Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.

Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.

Martin, D., K. Kadirvel, T. Nishida, and M. Sheplak, "A Surface Micromachined Capacitive Microphone for Aeroacoustic Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2008.

Martin, D., K. Kadirvel, J. Liu, R. M. Fox, M. Sheplak, and T. Nishida, "Surface and Bulk Micromachined Dual Back-Plate Condenser Microphone", 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami, FL, January, 2005.

Suthram, S., Y. Sun, P. Majhi, I. Ok, H. Kim, H. R. Harris, N. Goel, S. Parthasarathy, A. D. Koehler, A. Acosta, et al., "Strain Additivity in III-V Channels for CMOSFETs beyond 22nm Technology Node", 2008 VLSI Symposium on VLSI Technology, pp. 182-183, October, 2008.

Bhardwaj, S., M. Sheplak, and T. Nishida, "S/N Optimization and Noise Considerations for Piezoresistive Microphones", 16th International Conference on Noise in Physical Systems and 1/f Fluctuations, Gainesville, FL, World Scientific, pp. 549-552, October, 2001.

Kadirvel, S., F. Liu, S. Horowitz, T. Nishida, K. Ngo, L. Cattafesta, and M. Sheplak, "A Self-Powered Wireless Active Acoustic Liner", 12th AIAA/CEAS Aeroacoustics Conference, Cambridge, MA, May, 2006.