Publications

Found 5 results
Author Title [ Type(Desc)] Year
Filters: Author is Shorey, Aric B.  [Clear All Filters]
Conference Paper
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Hwangbo, S., Y.-K. Yoon, and A. Shorey, "Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications", 2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Fajardo, PR, USA, IEEE, 2016.
Rahimi, A., D. E. Senior, A. Shorey, and Y.-K. Yoon, "In-Substrate Resonators and Bandpass Filters with Improved Insertion Loss in K-Band Utilizing Low Loss Glass Interposer Technology and Superlattice Conductors", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
Hwangbo, S., A. B. Shorey, and Y.-K. Yoon, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
Journal Article
Clingenpeel, T., A. Rahimi, S. Hwangbo, Y.-K. Yoon, and A. Shorey, "Fabrication and characterization of advanced through glass via interconnects", International Symposium on Microelectronics, vol. 2016, issue 1, pp. 000288 - 000292, Feb-10-2016.