Publications

Found 11 results
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Conference Paper
Chandrasekharan, V., J. Sells, D. P. Arnold, and M. Sheplak, "Effect of dynamic pressure on direct shear stress sensor design", 48th AIAA Aerospace Sciences Meeting, AIAA Paper 2010-004, 01/2010.
Sheplak, M., and E. Spina, "Elimination of Impinging Jet Resonance", 31st AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 93-0733, Reno, NV, January, 1993.
V.S., A. Kasyap, J. Lim, K. Ngo, A. Kurdila, T. Nishida, M. Sheplak, and L. Cattafesta, "Energy Reclamation from a Vibrating Piezoceramic Composite Beam", 9th International Congress on Sound and Vibration, Orlando, FL, July, 2002.
Rueff, M., T. Schmitz, B. A. Griffin, D. Mills, and M. Sheplak, "Evaluation of Optical Fiber Positioning using Silicon V-Grooves", 39th North American Manufacturing Research Conference, Corvallis, OR, 2011.
Chandrasekharan, V., M. Sheplak, and L. Cattafesta, "Experimental Study of Acoustic Impedance of MEMS-Based Micro-Perforated Liners", 12th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2006-2401, Cambridge, MA, May, 2006.
Meloy, J., J. Sells, V. Chandrasekharan, J. Griffin, L. Cattafesta, D. P. Arnold, and M. Sheplak, "Experimental verification of a capacitive shear stress sensor for low-speed wind tunnel applications", Hilton Head 2012, Hilton Head Island, SC, 06/2012.
Meloy, J., J. Griffin, J. Sells, V. Chandrasekharan, L. Cattafesta, and M. Sheplak, "Experimental Verification of a MEMS Based Skin Friction Sensor for Quantitative Wall Shear Stress Measurement", 41st AIAA Fluid Dynamics Conference and Exhibit, Honolulu, Hawaii, 06/2011.
Journal Article
Chao, J., W. Shyy, S. Thakur, M. Sheplak, and R. Mei, "Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor", Numerical Heat Transfer-A, vol. 48, no. 3, pp. 197-217, AUG, 2005.
Kang, B., S. Kim, J. Kim, F. Ren, K. Baik, S. J. Pearton, B. P. Gila, C. Abernathy, C. Pan, G. Chen, et al., "Effect of External Strain on the Conductivity of AlGaN/GaN High-Electron-Mobility Transistors", Applied Physics Letters, vol. 83, no. 23, pp. 4845-4847, DEC, 2003.
Griffin, B. A., M. D. Williams, G. Wang, B. V. Sankar, L. N. Cattafesta, and M. Sheplak, "The electromechanical behavior of piezoelectric thin film composite diaphragms possessing in-plane stresses", Journal of Micromechanics and Microengineering, vol. 27, issue 4, pp. 045017, Jan-04-2017.
Xia, Z., R. Mei, M. Sheplak, and H. Z. Fan, "Electroosmotically-Driven Creeping Flows in a Wavy Microchannel", Microfluidics and Nanofluidics, vol. 6, no. 1, pp. 37-52, JAN, 2009.