Publications

Found 155 results
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Conference Paper
Ngo, K., A. Phipps, T. Nishida, J. Lin, and S. Xu, "Power Converters for Piezoelectric Energy Extraction", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14343, November, 2006.
Prasad, A., Q-S. Xue, V. Sankar, T. Nishida, G. Shaw, W. J. Streit, and J. C. Sanchez, "Predicting Microelectrode Array Functionality Using Biotic and Abiotic Metrics in Vivo", 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, San Diego, CA, Aug 28-Sep 1, 2012.
Kurdila, A., B. Carroll, T. Nishida, and M. Sheplak, "Reduced Order Modeling for Low Reynolds Number Flow Control", Proceedings of SPIEs 6th Annual International Symposium on Smart Structures and Materials, Mathematics Modeling and Control Conference, vol. 3667, Newport Beach, CA, pp. 68-79, March, 1999.
Wang, Z., J. Li, T. Nishida, and M. Sheplak, "Robust Capon Beamformers for Wideband Acoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3198, Hilton Head, SC, May, 2003.
Saini, R., S. Bhardwaj, T. Nishida, and M. Sheplak, "Scaling Relations for Piezoresistive Microphones", International Mechanical Engineering Congress and Exposition, Orlando, FL, November, 2000.
Smith, C. S., K. Sondhi, B. Y. Jimenez, H. Z. Fan, T. Nishida, and D. P. Arnold, "Screen-printed inductive silver ink strain sensor on stretchable TPU substrate", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Virtual, 2020.
Kadirvel, S., F. Liu, S. Horowitz, T. Nishida, K. Ngo, L. Cattafesta, and M. Sheplak, "A Self-Powered Wireless Active Acoustic Liner", 12th AIAA/CEAS Aeroacoustics Conference, Cambridge, MA, May, 2006.
Bhardwaj, S., M. Sheplak, and T. Nishida, "S/N Optimization and Noise Considerations for Piezoresistive Microphones", 16th International Conference on Noise in Physical Systems and 1/f Fluctuations, Gainesville, FL, World Scientific, pp. 549-552, October, 2001.
Suthram, S., Y. Sun, P. Majhi, I. Ok, H. Kim, H. R. Harris, N. Goel, S. Parthasarathy, A. D. Koehler, A. Acosta, et al., "Strain Additivity in III-V Channels for CMOSFETs beyond 22nm Technology Node", 2008 VLSI Symposium on VLSI Technology, pp. 182-183, October, 2008.
Martin, D., K. Kadirvel, J. Liu, R. M. Fox, M. Sheplak, and T. Nishida, "Surface and Bulk Micromachined Dual Back-Plate Condenser Microphone", 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami, FL, January, 2005.
Martin, D., K. Kadirvel, T. Nishida, and M. Sheplak, "A Surface Micromachined Capacitive Microphone for Aeroacoustic Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2008.
Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.
Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A Tunable Electromechanical Helmholtz Resonator", 9th AIAA/CEAS Aeroacoustics Conference and Exhibit, AIAA Paper 2003-3145, Hilton Head, SC, May, 2003.
Schultz, T., L. Cattafesta, T. Nishida, and M. Sheplak, "Uncertainty Analysis of the Two-Microphone Method", 8th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2002-2465, June, 2002.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3197, Hilton Head, SC, May, 2003.
Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.
Nishida, T., "Wireless Implantable Recording Electrodes (FWIRE) for Brain Machine Interfaces", IEEE International Symposium on Circuits and Systems, 2007 (ISCAS 2007), pp. 2084 , May, 2007.
Conference Proceedings
Z. Fan, H., S. Augustine, C. Wang, P. Gu, Z. Xia, and T. Nishida, "Electrically Controlled Thermoelastic Valve Array for Multiplexed Immunoassay", 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2016), 2016.
Wang, C-W., S. Augustine, T. Nishida, and Z.H. Fan, "Low-Power Electrically Controlled Thermoelastic Microfluidic Valve Array for Multiplexed Immunoassay", Hilton Head 2016 Workshop, 2016.
Nishida, T., "Mission Innovation: The Driver for Global Pollution Monitoring Node Today, Tomorrow and in 2025", Commercialization of Micro, Nano, and Emerging Technologies, 2016.
Nishida, T., "TSensors Vision: Enabling Sustainable Solutions for the Global Environment through Novel Sensing", MEMS & Sensors Executive Congress, 2016.