Publications

Found 6 results
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Filters: Author is Hwangbo, Seahee  [Clear All Filters]
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H
Hwangbo, S., A. B. Shorey, and Y.-K. Yoon, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
Hwangbo, S., Y.-K. Yoon, and A. Shorey, "Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications", 2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Fajardo, PR, USA, IEEE, 2016.
Hwangbo, S., H. Yong Yang, and Y-K. Yoon, "Mutual Coupling Reduction Using Micromachined Complementary Meander-Line Slots for a Patch Array Antenna", IEEE Antennas and Wireless Propagation Letters, vol. 16, pp. 1667 - 1670, Feb-02-2017.
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Hwangbo, S., A. Rahimi, and Y-K. Yoon, "Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications", 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, USA, IEEE, 2017.
Hwangbo, S., R. Bowrothu, H-in. Kim, and Y-K. Yoon, "Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.