Publications

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Chugh, D., K. R. Gluesenkamp, O. Abdelaziz, and S. Moghaddam, "Hybrid Membrane-based Ionic Liquid Absorption Cycle for Water Heating, Dehumidification, and Cooling", 12th IEA Heat Pump Conference, Rotterdam, Netherlands, 2017.
Chugh, D., K. R. Gluesenkamp, O. Abdelaziz, and S. Moghaddam, "Compact Membrane-based Hybrid Dehumidifier and Water Heater Absorption System", IVth International Symposium on Innovative Materials for Processes in Energy Systems, 2016.
Chugh, D., and S. Moghaddam, "Hybrid Absorption-based Water Heater Dehumidification System for Humid Climates", ASME HT/FE/ICNMM 2016, 2016.
Chung, J., and S. Moghaddam, "Molecular Dynamics Simulation of Phases Interactions in Membrane-based Absorption and Desorption Processes", ASME 3rd Micro/Nanoscale Heat & Mass Transfer International Conference, Atlanta, GA, 03/2012.
Chyczewski, S., S. Hwangbo, Y-K. Yoon, and D. P. Arnold, "Experimental demonstration of multi-watt wireless power transmission to ferrite-core receivers at 6.78 MHz", Wireless Power Transfer, vol. 6, issue 1, pp. 17 - 25, Jan-03-2019.
Cleveland, C., S. Moghaddam, and M. E. Orazem, "Nanometer-Scale Corrosion of Copper in De-Aerated Deionized Water", Journal of The Electrochemical Society, vol. 161, issue 3, pp. C107 - C114, May-12-2015, 2014.
Cleveland, C., M. E. Orazem, and S. Moghaddam, "Response to “Comment on Nanometer-Scale Corrosion of Copper in De-Aerated Deionized Water”", Journal of The Electrochemical Society, vol. 163, issue 3, pp. Y5 - Y11, Oct-12-2016.
Cleveland, C., M. E. Orazem, and S. Moghaddam, "Corrosion of Copper in De-Aerated Water by Impedance Spectroscopy", 223rd Electrochemical Society Meeting, Ontario, Canada, 05/2013.
Clingenpeel, T., and Y-K. Yoon, "Reliability of Cu/NiFe and Cu/Ni Metaconductor Devices for RF Applications", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Clingenpeel, T., A. Rahimi, S. Hwangbo, Y.-K. Yoon, and A. Shorey, "Fabrication and characterization of advanced through glass via interconnects", International Symposium on Microelectronics, vol. 2016, issue 1, pp. 000288 - 000292, Feb-10-2016.
Clingenpeel, T., S. Hwangbo, N. Garraud, D. P. Arnold, and Y-K. Yoon, "Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2018.
Correa, J., C. Crane, and H. Xie, "Kinematic Analysis and Design of a Compliant Microplatform", Proc. of the American Nuclear Society 2nd International Joint Topical Meeting on Emergency Preparedness & Response and Robotics & Remote Systems, 2008.
Correa, J., C. Crane, and H. Xie, "Kinematic Analysis of a Compliant Microplatform", ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering ConferenceVolume 2: 32nd Mechanisms and Robotics Conference, Parts A and B, Brooklyn, New York, USA, ASME, pp. 331 - 338, 2008.
Cremaschi, L., and S. Moghaddam, "Recent advances on heat and mass transfer in refrigeration and air-conditioning systems", Science and Technology for the Built Environment, vol. 23, issue 6, pp. 871 - 874, Jun-28-2017.
Cros, F., D. P. Arnold, M. G. Allen, S. Das, H. Koser, and J. H. Lang, "Micro-magnetic induction machines for portable power applications", Proc. Army Research Lab Collaborative Technology Alliances Conf., Power and Energy, College Park, MD, pp. 17-21, April, 2003.