Found 155 results
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Zhao, L., D. Hou, T-M. Usher, T. Iamsasri, C. M. Fancher, J. S. Forrester, T. Nishida, S. Moghaddam, and J. L. Jones, "Structure of 3 at.% and 9 at.% Si-doped HfO 2 from combined refinement of X-ray and neutron diffraction patterns", Journal of Alloys and Compounds, vol. 646, pp. 655 - 661, Jan-10-2015.
Sanchez, J. C., N. Alba, T. Nishida, C. Batich, and P. Carney, "Structural Modifications in Chronic Microwire Electrodes for Cortical Neuroprosthetics: A Case Study", IEEE Trans. Neural Systems and Rehab. Engr., vol. 14, no. 2, pp. 217-221, JUN, 2006.
Yang, X., J. Lim, G-Y. Sun, K. Wu, T. Nishida, and S. Thompson, "Strain-induced Changes in the Gate Tunneling Currents in p-channel Metal-Oxide-Semiconductor Field-Effect Transistors", Applied Phys. Lett., vol. 88, pp. 052108, JAN, 2006.
Yang, X., Y. Choi, J-S. Lim, T. Nishida, and S. Thompson, "Strain induced changes in the gate leakage current of n-channel metal-oxide-semiconductor field-effect transistors", J. Appl. Phys., vol. 109, pp. 9, 06/2011.
Son, S. Y., Y. Choi, P. Kumar, H. W. Park, T. Nishida, R. K. Singh, and S. Thompson, "Strain induced changes in gate leakage current and dielectric constant of nitrided Hf-silicate metal oxide semiconductor capacitors", Appl. Phys. Lett., vol. 93, pp. 153505-1–153505-3, OCT, 2008.
Baykan, M., S. Thompson, and T. Nishida, "Strain effects on three-dimensional, two-dimensional, and one-dimensional silicon logic devices: Predicting the future of strained silicon", Journal of Applied Physics, vol. 108, no. 9, pp. 093716-24, 11/2010.
Suthram, S., Y. Sun, P. Majhi, I. Ok, H. Kim, H. R. Harris, N. Goel, S. Parthasarathy, A. D. Koehler, A. Acosta, et al., "Strain Additivity in III-V Channels for CMOSFETs beyond 22nm Technology Node", 2008 VLSI Symposium on VLSI Technology, pp. 182-183, October, 2008.
Dieme, R., G. Bosman, M. Sheplak, and T. Nishida, "Source of Excess Noise in Silicon Piezoresistive Microphones", J. Acoustical Society of America, vol. 119, pp. 2710-2720, MAY, 2006.
Bhardwaj, S., M. Sheplak, and T. Nishida, "S/N Optimization and Noise Considerations for Piezoresistive Microphones", 16th International Conference on Noise in Physical Systems and 1/f Fluctuations, Gainesville, FL, World Scientific, pp. 549-552, October, 2001.
Chu, M., A. D. Koehler, A. Gupta, T. Nishida, and S. Thompson, "Simulation of AlGaN/GaN high-electron-mobility transistor gauge factor based on two-dimnensional electron gas density and electron mobility", J. Appl. Phys. , vol. 108, pp. 6, 11/2010.
Han, K., and T. Nishida, "Sequential substrate and channel hot electron injection to separate oxide and interface traps in n-MOST", Solid-State Electronics, vol. 38, pp. 105-113, JAN, 1995.
Kadirvel, S., F. Liu, S. Horowitz, T. Nishida, K. Ngo, L. Cattafesta, and M. Sheplak, "A Self-Powered Wireless Active Acoustic Liner", 12th AIAA/CEAS Aeroacoustics Conference, Cambridge, MA, May, 2006.
Smith, C. S., K. Sondhi, B. Y. Jimenez, H. Z. Fan, T. Nishida, and D. P. Arnold, "Screen-printed inductive silver ink strain sensor on stretchable TPU substrate", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Virtual, 2020.
Smith, C. S., K. Sondhi, S. C. Mills, J. S. Andrew, H. Z. Fan, T. Nishida, and D. P. Arnold, "Screen-printable and stretchable hard magnetic ink formulated from barium hexaferrite nanoparticles", Journal of Materials Chemistry C, 2020.
Saini, R., S. Bhardwaj, T. Nishida, and M. Sheplak, "Scaling Relations for Piezoresistive Microphones", International Mechanical Engineering Congress and Exposition, Orlando, FL, November, 2000.
Wang, Z., J. Li, T. Nishida, and M. Sheplak, "Robust Capon Beamformers for Wideband Acoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3198, Hilton Head, SC, May, 2003.
Choi, Y., H. W. Park, T. Nishida, and S. Thompson, "Reliability of HfSiON gate dielectric silicon MOS devices under [110] mechanical stress: Time dependent dielectric breakdown", J. Appl. Phys., vol. 105, pp. 044503-1–044503-5, FEB, 2009.
Kurdila, A., B. Carroll, T. Nishida, and M. Sheplak, "Reduced Order Modeling for Low Reynolds Number Flow Control", Proceedings of SPIEs 6th Annual International Symposium on Smart Structures and Materials, Mathematics Modeling and Control Conference, vol. 3667, Newport Beach, CA, pp. 68-79, March, 1999.
Dieme, R., J. Zhang, N. G. Rudawski, K. Jones, G. Bosman, M. Sheplak, and T. Nishida, "Process Dependence of 1/f Noise and Defects in Ion Implanted p-Type Piezoresistors", Journal of Applied Physics, vol. 112, 2012.
Chow, E., A. Partridge, V. Chandrasekaran, M. Sheplak, T. Nishida, C. Quate, and T. Kenny, "Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.
Prasad, A., Q-S. Xue, V. Sankar, T. Nishida, G. Shaw, W. J. Streit, and J. C. Sanchez, "Predicting Microelectrode Array Functionality Using Biotic and Abiotic Metrics in Vivo", 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, San Diego, CA, Aug 28-Sep 1, 2012.
Ngo, K., A. Phipps, T. Nishida, J. Lin, and S. Xu, "Power Converters for Piezoelectric Energy Extraction", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14343, November, 2006.
Thompson, S., and T. Nishida, "Positive charge generation in SiO2 by electron-impact-emission of trapped electrons", Journal of Applied Physics, vol. 72, pp. 4683-4695, NOV, 1992.
Arnold, D. P., S. Bhardwaj, S. Gururaj, T. Nishida, and M. Sheplak, "A Piezoresistive Microphone for Aeroacoustic Measurements", Proc. of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23841, vol. 2, New York, NY, November, 2001.
Papila, M., R. T. Haftka, T. Nishida, and M. Sheplak, "Piezoresistive Microphone Design Pareto Optimization: Tradeoff Between Sensitivity and Noise Floor", 44th AIAA/ASME/ASCE/AHS Structures, Structural Dynamics, and Materials Conference, AIAA Paper 2003-1632, Norfolk, VA, April, 2003.