Publications

Thompson, S., and T. Nishida, "Tunneling and thermal emission of electrons from a distribution of shallow traps in SiO2", Applied Physics Letters, vol. 58, pp. 1262-1264, DEC, 1991.

Park, H. W., S. K. Dixit, Y. Choi, R. D. Schrimpf, E. Filangeri, T. Nishida, and S. Thompson, "Total Ionizing Dose Effects on Strained HfO2-based nMOSFETs", IEEE Transactions on Nuclear Science, vol. 55, pp. 2981-2985, DEC, 2008.

Streit, W. J., Q-S. Xue, A. Prasad, V. Sankar, E. Knott, A. T. Dyer, J. R. Reynolds, T. Nishida, G. Shaw, and J. C. Sanchez, "Tissue, Electrical, and Material Responses in Electrode Failure", IEEE Pulse, vol. 3, issue 1, pp. 30 - 33, 01/2012.

Walters, G., A. Shekhawat, N. G. Rudawski, S. Moghaddam, and T. Nishida, "Tiered deposition of sub-5 nm ferroelectric Hf _1-x Zr _x O ₂ films on metal and semiconductor substrates", Applied Physics Letters, vol. 112, issue 19, pp. 192901, Jul-05-2018.

Lu, S., T. Nishida, and C-T. Sah, "Thermal emission and capture rates of holes at the gold donor level in silicon", Journal of Applied Physics, vol. 62, no. 12, pp. 4773-4780, DEC, 1987.

Yang, X., S. Parthasarathy, Y. Sun, A. D. Koehler, T. Nishida, and S. Thompson, "Temperature dependence of enhanced hole mobility in uniaxial strained p-channel metal-oxide-semiconductor field-effect transistors and insight into the physical mechanisms", Appl. Phys. Lett., vol. 93, pp. 243503-1–243503-3, DEC, 2008.

Sanchez, J. C., J. Principe, T. Nishida, R. Bashirullah, J. Harris, and J. Fortes, "Technology and Signal Processing for Brain-Machine Interfaces", IEEE Signal Processing Magazine, vol. 25, pp. 29-40, SEP, 2008.

Walters, G., A. Shekhawat, N. G. Rudawski, S. Moghaddam, and T. Nishida, Tiered deposition of sub-5 nm ferroelectric Hf1-xZrxO2 films on metal and semiconductor substrates, 2018.

Nishida, T., "TSensors Vision: Enabling Sustainable Solutions for the Global Environment through Novel Sensing", MEMS & Sensors Executive Congress, 2016.

Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A Tunable Electromechanical Helmholtz Resonator", 9th AIAA/CEAS Aeroacoustics Conference and Exhibit, AIAA Paper 2003-3145, Hilton Head, SC, May, 2003.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.

Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.

Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.