Publications

Found 189 results
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Conference Paper
Xie, H., "MEMS-based endoscopic optical coherence tomography", (invited) Proc. of the 3rd Asian and Pacific Rim Symposium on Biophotonics, Cairns, Australia, July, 2007.
Xie, H., "MEMS-Based Optical Coherence Imaging", 2005 Pacific Rim Conference on Lasers & Electro-Optics2005 Pacific Rim Conference on Lasers & Electro-Optics, Tokyo, Japan, IEEE, pp. 187 - 188, 2005.
Xie, H., G. K. Fedder, and Y. Pan, "MEMS-based Optical Coherence Tomography", Proceedings of at the SPIE Photonics West: MOEMS-MEMS 2005, San Jose, CA, 2005.
Tuzzo, S., D. Martin, T. Nishida, L. Cattafesta, and M. Sheplak, "A MEMS-Based Sound Intensity Probe", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3260, Hilton Head, SC, May, 2003.
Chandrasekharan, V., J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, "A Metal-On-Silicon Differential Capacitive Shear Stress Sensor", Tech. Dig. 15th Int. Conf. Solid-State Sensors, Actuators, and Microsystems (Transducers 2009), Denver, CO, June, 2009.
Lee, W., H. Kim, and Y-K. Yoon, "Metamaterial-inspired dual-function loop antenna for wireless power transfer and wireless communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2020.
Paneri, A., and S. Moghaddam, "Methanol and Proton Transport Characteristics of Graphene Oxide Proton Exchange Membrane", ASME 2013 Fuel Cell Science, Engineering and Technology Conference, Minneapolis, MN, 07/2013.
Bowers, B., J. Agashe, and D. P. Arnold, "A method to form bonded micromagnets embedded in silicon", Proc. 14th Int. Conf. Solid-State Sensors, Actuators, and Microsystems (Transducers 07), vol. 2, pp. 1581-1584, June, 2007.
Divakar, V., Y. Zhang, J. Zito, E. A. Salley, and D. P. Arnold, "Microelectromechanical inductor with high inductance density via mechanical energy storage", Tech. Dig. 11th Int. Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Apps. (PowerMEMS 2011), Seoul, Korea, pp. pp. 181-184, 11/2011.
Garraud, N., D. Alabi, J.D. Varela, D. P. Arnold, and A. Garraud, "Microfabricated electrodynamic wireless power receiver for bio-implants and wearables", 2018 Digital Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, South Carolina, USASan Diego, Transducer Research Foundation, 2018.
Sells, J., V. Chandrasekharan, J. Meloy, M. Sheplak, H. Zmuda, and D. P. Arnold, "Microfabricated silicon-on-Pyrex passive wireless wall shear stress sensor", 2011 IEEE Sensors2011 IEEE SENSORS Proceedings, Limerick, Ireland, IEEE, pp. 77 - 80, 2011.
Bowers, B., O. D. Oniku, and D. P. Arnold, "Microfabrication and process integration of powder-based permanent magnets", Technologies for Future Micro-Nano Manufacturing, Napa, California, August 2011.
Li, Y., T. Nishida, D. P. Arnold, and M. Sheplak, "Microfabrication of a wall shear stress sensor using side-implanted piezoresistive tethers", Proceeding of SPIE 14th Annual International Symposium on Smart Structures and Materials, Paper No.6529-13, San Diego, CA, May, 2007.
Velez, C., and D. P. Arnold, "Microfabrication of magnetically attached end effectors for micro/milli robots", Proc. 2017 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS 2017), Montreal, Canda, 07/2017.
Kim, J., K. Lee, K. W. Oh, and Y.K. Yoon, "Microfabrication of rounded channel and waveguide integrated microlens using timed development and thermal reflow process", The 13th International Conference on Miniaturized Systems for Chemistry and Life Sciences, Jeju Island, Korea , 11/2009.
Lee, K., C. Kim, Y. Kim, J. Bang, B. Ahn, J. Kim, and Y.K. Yoon, "Microfluidic network-based combinatorial dilution device with an initial concentration controller", International Conference on Miniaturized Systems for Chemistry and Life Sciences , Groningen, The Netherlands, 09/2010.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor", 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1042, Reno, NV, January, 2004.
Horowitz, S., T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Piezoelectric Microphone for Aeroacoustics Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2006.
Meyer, C. D., S. S. Bedair, B. C. Morgan, and D. P. Arnold, "Micromachined thick-film copper power inductors and transformers for integrated power converters", Solid-State Sensors, Actuators, and Microsystems Workshop (Hilton Head 2010), Hilton Head, SC, pp. 455-458, 06/2010.
Cros, F., D. P. Arnold, M. G. Allen, S. Das, H. Koser, and J. H. Lang, "Micro-magnetic induction machines for portable power applications", Proc. Army Research Lab Collaborative Technology Alliances Conf., Power and Energy, College Park, MD, pp. 17-21, April, 2003.
Morgan, B. C., S. S. Bedair, W. Nothwang, D. P. Arnold, C. D. Meyer, B. Bowers, A. Sopeju, C. M. Dougherty, L. Xue, and R. Bashirullah, "Micro-power requirements & conversion for autonomous microsystems", NATO SET-150 Specialist Meeting on Energy Technologies & Management for Portable Power for Military Applications, Brdo pri Kranju, Slovenia, 05/2009.
Zito, J., D. P. Arnold, T. Houba, J. Soni, R. Durscher, and S. Roy, "Microscale dielectric barrier discharge plasma actuators: performance characterization and numerical comparison", 43rd AIAA Plasmadynamics and Lasers Conf., New Orleans, LA, AIAA, 06/2012.
Garraud, A., O. D. Oniku, W. C. Patterson, E. Shorman, D. LeRoy, N. M. Dempsey, and D. P. Arnold, "Microscale Magnetic Patterning Of Hard Magnetic Films Using Microfabricated Magnetizing Masks", 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), San Francisco, CA, IEEE, 2014.
Fazeli, A., and S. Moghaddam, "Microscale Phase Separation through Nanoporous Membranes", ASME 2013 Summer Heat Transfer Conference, Minneapolis, MN, 2013.
Hwangbo, S., A. B. Shorey, and Y.-K. Yoon, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.