Publications

Zhang, X., L. Zhou, C. Duan, D. Zheng, S. Koppal, Q. Tanguy, and H. Xie, "A wide-angle immersed MEMS mirror and its application in optical coherence tomography", 2016 International Conference on Optical MEMS and Nanophotonics (OMN), Singapore, Singapore, IEEE, 2016.

Zhang, X., S. J. Koppal, R. Zhang, L. Zhou, E. Butler, and H. Xie, "Wide-angle structured light with a scanning MEMS mirror in liquid", Optics Express, vol. 24, issue 4, no. 4, pp. 3479-3487, 02/2016.

Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", J. Acoust. Soc. Am., vol. 115, no. 2, pp. 757-767, MAR, 2004.

Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3197, Hilton Head, SC, May, 2003.

Wang, N., B. Bowers, and D. P. Arnold, "Wax-bonded NdFeB micromagnets for microelectromechanical systems application", J. Applied Physics, vol. 103, pp. 07E109, 04/2008.

Smith, S. E., M. A. Halim, S. T. Chyczewski, A. A. Rendon-Hernandez, and D. P. Arnold, "A Wirelessly Rechargeable AA Battery Using Electrodynamic Wireless Power Transmission", Energies, vol. 14, issue 9, pp. 2368, Jan-05-2021.

Senior, D., X. Cheng, PF. Jao, C. Kim, J. Kim, and Y.K. Yoon, "Wireless passive sensing application using a cavity loaded evanescent wave half mode substrate integrated waveguide resonator", The 16th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, June 2011.

Nishida, T., "Wireless Implantable Recording Electrodes (FWIRE) for Brain Machine Interfaces", IEEE International Symposium on Circuits and Systems, 2007 (ISCAS 2007), pp. 2084 , May, 2007.

Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.

Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.

Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.

Lee, W., and Y-K. Yoon, "Wireless Power Transfer Systems Using Metamaterials: A Review", IEEE Access, vol. 8, pp. 147930 - 147947, Jan-01-2020.

Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.

Garraud, A., D. J. Munzer, M. Althar, N. Garraud, and D. P. Arnold, "Watt-level wireless power transmission to multiple compact receivers", Journal of Physics: Conference Series, vol. 660, no. 1, pp. 012039, 2015.

Cheng, S., and D. P. Arnold, "Wireless power transmission via magnetic coupling to an electrodynamic receiver", 10th Int. Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Apps. (PowerMEMS 2010), Leuven, Belgium, pp. 61-64, 12/2010.

Challa, V. R., V. Divakar, J. Oscar Mur-Miranda, and D. P. Arnold, "Wireless power transmission to an electrodynamic energy harvester using low-frequency magnetic fields", Tech. Dig. 11th Int. Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Apps. (PowerMEMS 2011), Seoul, Korea, pp. pp. 335-338, 11/2011.

Challa, V. R., J. Oscar Mur-Miranda, and D. P. Arnold, "Wireless power transmission to an electromechanical receiver using low-frequency magnetic fields", Smart Materials and Structures, vol. 21, issue 11, pp. 115017, 11/2012.

Baek, SK., Y.K. Yoon, and J-H. Park, "Wireless actuated microvalve system using induction heating and its thermal effect on the microfluidic system", International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, 06/2011.