Publications

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Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.