Publications

Found 2 results
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Filters: First Letter Of Title is R and Author is Clingenpeel, Timothy  [Clear All Filters]
Conference Paper
Clingenpeel, T., and Y-K. Yoon, "Reliability of Cu/NiFe and Cu/Ni Metaconductor Devices for RF Applications", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Yoon, Y. K., S. Hwangbo, T. Clingenpeel, and A. Rahimi, "Recent Advancement on Low Loss Meta-conductor Technology for Energy Effi-cient 5G and Millimeter Wave Applica-tions", 2017 Microprocessors and Nanotechnology Conference (MNC), Jeju, South Korea, 2017.