Publications

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M
Hwangbo, S., A. B. Shorey, and Y.-K. Yoon, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.