Publications
Found 1 results
Author [ Title] Type Year Filters: First Letter Of Title is L and Author is Kim, Hae-in [Clear All Filters]
"Low Loss Cu/Co Multilayer Metaconductor Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
,