Publications

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D
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.