Publications

Found 1228 results
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2018
Liao, W., E. Xia Zhang, M. L. Alles, A. L. Sternberg, C. N. Arutt, D. Wang, S. E. Zhao, P. Wang, M. W. McCurdy, H. Xie, et al., "Total-Ionizing-Dose Effects on Al/SiO 2 Bimorph Electrothermal Microscanners", IEEE Transactions on Nuclear Science, vol. 65, issue 8, pp. 2260 - 2267, Jan-08-2018.
Chai, J., H. Jia, X. Dong, C. Huang, L. Jiang, and H. Xie, "Trace Gas Detection Using a MEMS-Based Portable Fourier Transform Infrared Spectrometer", Fourier Transform SpectroscopyLight, Energy and the Environment 2018 (E2, FTS, HISE, SOLAR, SSL), SingaporeWashington, D.C., OSA, 2018.
Chen, Q., H. Guo, T. Jin, W. Qi, H. Xie, and L. Xi, "Ultracompact high-resolution photoacoustic microscopy", Optics Letters, vol. 43, issue 7, pp. 1615, Jan-01-2018.
Jiang, X., J. C. Loeb, C. Manzanas, J. A. Lednicky, and H. Z. Fan, "Valve‐Enabled Sample Preparation and RNA Amplification in a Coffee Mug for Zika Virus Detection", Angew Chem Int Ed Engl, vol. 57, issue 52, 10/2018.
2019
Mills, D. A., W. C. Patterson, B. Freidkes, C. Keane, and M. Sheplak, "Characterization of a Fully-Differential, Dual-Axis, Capacitive Wall Shear Stress Sensor System for Low-Speed Wind Tunnels", AIAA Aviation 2019 ForumAIAA Aviation 2019 Forum, Dallas, TexasReston, Virginia, American Institute of Aeronautics and Astronautics, 2019.
Dopico, P., K. Chen, J. I. Varillas, V. Pedrosa, T. J. George, and H. Z. Fan, "Circulating Tumor Cell Isolation from Clinical Samples Utilizing a Lateral Filter Array Microfluidic Device", MicroTAS 2019, October 2019.
Wang, D., C. Watkins, S. Koppal, M. Li, Y. Ding, and H. Xie, "A Compact Omnidirectional Laser Scanner Based on an Electrothermal Tripod Mems Mirror for Lidar Please Leave", 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Berlin, Germany, IEEE, 2019.
Freidkes, B., D. A. Mills, C. Keane, L. S. Ukeiley, and M. Sheplak, "Development of a Two-Dimensional Wall Shear Stress Sensor for Wind Tunnel Applications", AIAA Scitech 2019 ForumAIAA Scitech 2019 Forum, San Diego, CaliforniaReston, Virginia, American Institute of Aeronautics and Astronautics, 2019.
Zhou, L., Y. Chen, X. Chen, Y. Hao, J. Coleman, and H. Xie, "Development of an electrothermal MEMS mirror based two-photon microscopy probe", Multiphoton Microscopy in the Biomedical Sciences XIXMultiphoton Microscopy in the Biomedical Sciences XIX, San Francisco, United States, SPIE, 2019.
Shekhawat, A., G. Walters, C. Chang Chung, Y. Liu, R. Garcia, J. Jones, T. Nishida, and S. Moghaddam, Effect of furnace annealing on the ferroelectricity of Hf0.5 Zr0.5O2 thin films, 2019.
Smith, C. S., K. Sondhi, H. Z. Fan, T. Nishida, and D. P. Arnold, "Effect of Mechanical Cycling on the Magnetic Properties of Permalloy Films Electroplated on Stretchable Substrates", 2019 IEEE International Flexible Electronics Technology Conference (IFETC)2019 IEEE International Flexible Electronics Technology Conference (IFETC), Vancouver, BC, Canada, IEEE, 2019.
Rendon-Hernandez, A. A., M. Ferrari, S. Basrour, and V. Ferrari, "Electrical modelling and characterization of a Thermo-Magnetically Activated Piezoelectric Generator (TMAPG)", Journal of Physics: Conference Series, vol. 1407, pp. 012058, Jan-11-2019.
Zhou, L., X. Zhang, and H. Xie, "An Electrothermal Cu/W Bimorph Tip-Tilt-Piston MEMS Mirror with High Reliability", Micromachines, vol. 10, issue 5, pp. 323, Jan-05-2019.
An Electrothermal Micromirror with J-shaped Bimorph Microactuators, 2019.
Zhou, L., D. Wang, and H. Xie, "An Electrothermal Micromirror with J-shaped Bimorph Microactuators", 2019 International Conference on Optical MEMS and Nanophotonics (OMN)2019 International Conference on Optical MEMS and Nanophotonics (OMN), Daejeon, Korea (South), IEEE, 2019.
Xie, H., S. Koppal, X. Zhang, L. Zhou, and C. Duan, Endoscopic OCT probes with immersed mems mirrors, no. US20190150715A1, 2019.
Chyczewski, S., S. Hwangbo, Y-K. Yoon, and D. P. Arnold, "Experimental demonstration of multi-watt wireless power transmission to ferrite-core receivers at 6.78 MHz", Wireless Power Transfer, vol. 6, issue 1, pp. 17 - 25, Jan-03-2019.
Lee, W., and Y-K. Yoon, "Experimental investigation of wireless power transfer with metamaterial,", UKC 2019, 2019.
Zhou, L., Z. Li, M. Liang, Y. Chen, X. Zhang, and H. Xie, "A fiber scanner based on a robust Cu/W bimorph electrothermal MEMS stage", MOEMS and Miniaturized Systems XVIIIMOEMS and Miniaturized Systems XVIII, San Francisco, United States, SPIE, 2019.
Sondhi, K., N. Garraud, D. Alabi, D. P. Arnold, A. Garraud, S. G. R. Avuthu, Z. H. Fan, and T. Nishida, "Flexible screen-printed coils for wireless power transfer using low-frequency magnetic fields", Journal of Micromechanics and Microengineering, vol. 29, issue 8, pp. 084006, Jan-08-2019.
Halim, M. A., H. M. Kabir, H. Cho, and J. Yeong Park, "A Frequency Up-Converted Hybrid Energy Harvester Using Transverse Impact-Driven Piezoelectric Bimorph for Human-Limb Motion", Micromachines, vol. 10, issue 10, pp. 701, Jan-10-2019.
Taylor, A. P., C. Velez Cuervo, D. P. Arnold, and L. Fernando Velasquez-Garcia, "Fully 3D-Printed, Monolithic, Mini Magnetic Actuators for Low-Cost, Compact Systems", Journal of Microelectromechanical Systems, vol. 28, issue 3, pp. 481 - 493, Jan-06-2019.
Kim, H-in., S. Hwangbo, R. Bowrothu, and Y-K. Yoon, "Highly Compact, Multiband Composite-Right/Left-Handed(CRLH) Transmission Line Based Stub for GPS Applications", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.
Zhou, H., D. A. Mills, A. Vera, A. Garraud, W. Oates, and M. Sheplak, "A High-Temperature Optical Sapphire Pressure Sensor For Harsh Environments", AIAA Scitech 2019 Forum, San Diego, CaliforniaReston, Virginia, American Institute of Aeronautics and Astronautics, 2019.
Hwangbo, S., R. Bowrothu, H-in. Kim, and Y-K. Yoon, "Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.