Publications

Found 1228 results
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Conference Paper
Cheng, S., and D. P. Arnold, "Wireless power transmission via magnetic coupling to an electrodynamic receiver", 10th Int. Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Apps. (PowerMEMS 2010), Leuven, Belgium, pp. 61-64, 12/2010.
Challa, V. R., V. Divakar, J. Oscar Mur-Miranda, and D. P. Arnold, "Wireless power transmission to an electrodynamic energy harvester using low-frequency magnetic fields", Tech. Dig. 11th Int. Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Apps. (PowerMEMS 2011), Seoul, Korea, pp. pp. 335-338, 11/2011.
Senior, D., X. Cheng, PF. Jao, C. Kim, J. Kim, and Y.K. Yoon, "Wireless passive sensing application using a cavity loaded evanescent wave half mode substrate integrated waveguide resonator", The 16th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, June 2011.
Nishida, T., "Wireless Implantable Recording Electrodes (FWIRE) for Brain Machine Interfaces", IEEE International Symposium on Circuits and Systems, 2007 (ISCAS 2007), pp. 2084 , May, 2007.
Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.
Baek, SK., Y.K. Yoon, and J-H. Park, "Wireless actuated microvalve system using induction heating and its thermal effect on the microfluidic system", International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, 06/2011.
Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3197, Hilton Head, SC, May, 2003.
Zhang, X., L. Zhou, C. Duan, D. Zheng, S. Koppal, Q. Tanguy, and H. Xie, "A wide-angle immersed MEMS mirror and its application in optical coherence tomography", 2016 International Conference on Optical MEMS and Nanophotonics (OMN), Singapore, Singapore, IEEE, 2016.
Garraud, A., D. J. Munzer, M. Althar, N. Garraud, and D. P. Arnold, "Watt-level wireless power transmission to multiple compact receivers", Journal of Physics: Conference Series, vol. 660, no. 1, pp. 012039, 2015.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
Cheng, S., R. Sathe, R. D. Natarajan, and D. P. Arnold, "A Voltage-Multiplying Self-Powered AC/DC Converter with 0.35 V Minimum Input Voltage for Energy Harvesting Applications", Applied Power Electronics Conf. & Exposition (APEC 2011), Fort Worth, TX, pp. 1311-1318, 03/2011.
Lee, S. Jin, J. Sun, M. King, H. Xie, and M. Sarntinoranont, "Viscoelastic Property Changes of Acute Rat Brain Tissue Slices As A Function Of Cell Viability", ASME 2011 Summer Bioengineering Conference (SBC2011), Famington, Pennsylvania, USA, June 22-25, 2011.
Williams, M. D., B. A. Griffin, B. Homeijer, B. V. Sankar, and M. Sheplak, "Vibration of Post-Buckled Homogeneous Circular Plates", IEEE Ultrasonics Symposium, 2007: IEEE, October, 2007.
Albertani, R., P. Khambatta, A. Hart, L. Ukeiley, M. Oyarzun, L. Cattafesta, and G. Abate, "Validation of a Low Reynolds Number Aerodynamic Characterization Facility", 47th AIAA Aerospace Sciences Meeting, AIAA Paper 2009-0880, January, 2009.
Bernard, B. P., J. W. Peyser, B. Mann, and D. P. Arnold, "Using the mass ratio to induce band gaps in a 1D array of nonlinearly coupled oscillators", Proc. ASME 2012 Int. Design Engineering Tech. Conf. & Computers and Information in Eng. Conf. (IDETC/CIE 2012), Chicago, IL, ASME, 08/2012.
Li, C.Y., G.M. Li, V.O.K. Li, P.K.A. Wai, H. Xie, and X.C. Yuan, "Using 2 x 2 switching modules to build large 2-D MEMS optical switches", GLOBECOM '03. IEEE Global Telecommunications Conference (IEEE Cat. No.03CH37489)GLOBECOM '03. IEEE Global Telecommunications Conference (IEEE Cat. No.03CH37489), vol. 5, San Fransico, CA, USA, IEEE, pp. 2798 - 2802, 2003.
Gurav, S., A. Kasyap V.S., M. Sheplak, L. Cattafesta, R. T. Haftka, J. Goosen, and F. Van Keulen, "Uncertainty-based Design Optimization of a Micro Piezoelectric Composite Energy Reclamation Device", 10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference, Albany, New York, September, 2004.
Schultz, T., L. Cattafesta, T. Nishida, and M. Sheplak, "Uncertainty Analysis of the Two-Microphone Method", 8th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2002-2465, June, 2002.
Yardibi, T., C. Bahr, N. Zawodny, F. Liu, L. Cattafesta, and J. Li, "Uncertainty Analysis of the Standard Delay-and-Sum Beamformer and Array Calibration", 15th AIAA/CEAS Aeroacoustics Conference, Miami, FL, May, 2009.
Meyer, C. D., S. S. Bedair, B. C. Morgan, and D. P. Arnold, "Ultra-miniaturized power converter modules using micromachined copper scaffolds", Hilton Head 2012, Hilton Head Island, SC, 06/2012.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
Wang, D., X. Zhang, L. Zhou, M. Liang, D. Zhang, and H. Xie, "An ultra-fast electrothermal micromirror with bimorph actuators made of copper/tungsten", 2017 International Conference on Optical MEMS and Nanophotonics (OMN)2017 International Conference on Optical MEMS and Nanophotonics (OMN), Santa Fe, NM, USA, IEEE, 2017.