Ultra-Miniature Power Managment for Microsystems Platforms

Goal

To generate and demonstrate an ultra-miniature, adaptable power conversion and management platform that can be tailored to suit the various power needs of the next generation of micro air vehicles and robots.

Features

High-voltage ( up to 150 V )
High-frequency ( up to 500 MHz )
High-efficiency ( greater than 90% )

Publications

Meyer, C.D., Sopeju, A., Dougherty, C., Xue, L., Li, P., Bashirullah, R., and Arnold, D.P., "Integrated passive components for high frequency switching dc-dc power converters in microscale robots," Intl. Workshop on Power Supply on Chip (Power SoC), Cork, Ireland, September 2008.

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Ultra-Miniature Power Managment for Microsystems Platforms Sponsored by Army Research Lab Last Modified: Aug 12th 2008 Investigators David Arnold (PI) Rizwan Bashirullah Student Research Assistants Israel Boniche Christopher Meyer Description High-density MEMS passive components (inductors and capacitors) are designed, optimized, and fabricated for use in ultra-miniature power conversion and management. These components will be either monolithically or flip-chip integrated with CMOS switches and control circuitry. Goal To generate and demonstrate an ultra-miniature, adaptable power conversion and management platform that can be tailored to suit the various power needs of the next generation of micro air vehicles and robots. Features High-voltage ( up to 150 V ) High-frequency ( up to 500 MHz ) High-efficiency ( greater than 90% ) Publications Meyer, C.D., Sopeju, A., Dougherty, C., Xue, L., Li, P., Bashirullah, R., and Arnold, D.P., "Integrated passive components for high frequency switching dc-dc power converters in microscale robots," Intl. Workshop on Power Supply on Chip (Power SoC), Cork, Ireland, September 2008.